TIS420C
Thermally conductive Gap Filler
SILCOOL TIS420C is a one component thermally conductive Gap Filler. TIS420C is dispensed as a thixotropic paste, and cures at room temperature to become a mechanically stable silicone gel. Due to its curing performance, SILCOOL TIS420C provides improved stability in 3-dimensional and vertical TIM applications that require a stress-absorbing,pump-out resistant, mechanically stable, and repairable heat path
- High thermal conductivity
- Physical stability due to polymerization during cure process
- Soft, stress-absorbing post cure properties
- Can be dispensed in various thickness
- Conforms to intricate shapes and component designs
- Use within a broad operating temperature range
- Repairable
Thermal interface for electronic components in consumer and automotive application