ASEC Epoxy Based
ASEC Epoxy Based
Low-temperature curing adhesives
Low-stress / Low-strain adhesives
Primary / Secondary encapsulation materials
Primary / Secondary encapsulation materials
Semiconductor for BGA, CSP and Flip Chip package
ASEC Epoxy Based
Low-temperature curing adhesives
Low-stress / Low-strain adhesives
Primary / Secondary encapsulation materials
Primary / Secondary encapsulation materials
Semiconductor for BGA, CSP and Flip Chip package