TIA251 2 Parts Gap Filler
Thermally conductive silicone gap filler
SILCOOL TIA251GF is a 2-component thermally conductive silicone gap filler. TIA251GF cures quickly with heat or at room temperature to become a soft, repairable thermally conductive Gap Filler. TIA251GF is applied as a dispensable paste which helps minimize assembly pressure during fastening of heat sinks, and can conform to non-planar or 3-dimensional interfaces. After cure, TIA251GF provides low hardness for stress relief and can control bleed at levels lower than many similar gap filler alternatives.
- Good thermal conductivity
- Easy to use 1-to-1 mixing ratio
- Non-slumping after dispense
- Conforms to complex shapes of 3-dimensional components
- Cures quickly with heat or at room temperature
- Low hardness
- Electrically insulative
- Bleed control
- Repairable
- Room temperature storage